Conference Overview
PAIC2027 · Physical AI · Reshaping the World
Conference Introduction
PAIC2027 (Physical AI Conference & Exhibition 2027) is an international Physical AI industry event co-hosted by the Chinese Association for Artificial Intelligence, the Department of Science and Technology of Zhejiang Province, and the Hangzhou Municipal Peoples Government. The conference focuses on the cutting-edge interdisciplinary field of Physical AI, covering five core tracks: AI chips and computing infrastructure, embodied intelligence and robotics, industrial digital twins and simulation, intelligent sensing and edge computing, and industrial AI and smart manufacturing. The event will be held from March 25-27, 2027 at the Hangzhou International Expo Center, covering 30,000 sqm of exhibition space, attracting 700+ top enterprises and 50,000+ professional visitors. Concurrent events include the Global Launch Media Day, main forum + 6 theme sub-forums, supply-demand matchmaking meetings, industry tours, and the National Platform Selection Program, creating a one-stop Physical AI industry platform.
Organizers
Guidance and Cooperating Units
- Zhejiang Science Communication Center
- Zhejiang Newspaper Group (Tide News, Zhejiang Business Magazine)
- National Science and Technology Communication Center (CAST)
- Zhejiang Digital Economy Industry Society
- Xiaoshan Xinmo Community (Tuling Town)
- Xinchuang Community (Information Port Town)
- Xinji Community (China Vision Valley Window Park) etc.
Organizing Units
- Shanghai Tiansheng Exhibition Service Co., Ltd.
- Hangzhou Hi-Box Software Technology Development Co., Ltd.
Exhibition Schedule
Day 1
- Opening Ceremony & Keynote Speeches
- Global Launch Media Day
- Exhibition Open (9:00-17:30)
- Welcome Banquet (18:30)
Day 2
- Six Theme Sub-forums (Full Day)
- Supply-Demand Matchmaking (13:00-17:00)
- Exhibition Open (9:00-17:30)
- Industry Tour Registration Deadline
Day 3
- Industry Tour (9:00-16:00)
- Closing Forum & Summary Release
- Exhibition Open (9:00-15:00)
- Move-out (from 15:00)
Five Concurrent Special Events
Global Launch Media Day
An annual global launch platform for groundbreaking Physical AI products and technologies, covering chips, robotics, simulation software, sensors and more. Expected to unveil 30+ new products with 200+ global media outlets in attendance.
Main Forum + 6 Sub-forums
The main forum focuses on “Physical AI: Industrial Implementation and the Next Decade,” with six sub-forums covering AI chips, embodied intelligence, digital twins, smart sensing, industrial AI, and AI safety and ethics. Featuring 100+ world-renowned scholars and industry leaders.
Supply-Demand Matchmaking
A big-data-driven B2B matchmaking platform that collects supply and demand requirements in advance and arranges one-on-one meetings during the exhibition. Expected to facilitate 500+ targeted connections.
Industry Tour
Organizes professional visitors to tour benchmark enterprises, laboratories, and innovation centers in the Hangzhou Bay AI industry cluster, experiencing Physical AI technology applications in real-world scenarios. Limited to 100 participants, advance registration required.
National Platform Selection Program
Leveraging national innovation platforms to solicit outstanding Physical AI projects from exhibitors, providing comprehensive support including policy connections, capital links, and market promotion to accelerate the growth of innovative projects.
Exhibitor Value
- Direct access to 50,000+ professional visitors and purchasing decision-makers
- Global Launch Media Day for top-tier brand exposure
- Precision matchmaking for efficient customer acquisition
- National Platform Selection Program for policy and capital support
Visitor Value
- One-stop overview of the latest Physical AI industry technologies
- Free access to the main forum and six sub-forums
- Network face-to-face with 700+ enterprises to discover opportunities
- Industry tour for firsthand experience of technology implementation